Job: Additive Manufacturing Technical Specialist
|Job Title:||Additive Manufacturing Technical Specialist|
|Salary:||Circa £50,000 + Competitive Benefits|
|Contact Name:||Choleigh McGuire|
|Job Published:||2 months ago|
Circa £50,000 + Competitive Benefits
Are you an expert in Additive Manufacturing?
Reporting to the Electronics Manufacturing manager this exciting role will strengthen the capability of an already advanced team as they support key clients across the manufacturing industry with advanced electronics packaging development.
In return you will work with a passionate multi-disciplined team within world-class facilities and get to contribute to the continuous advancement of Great British manufacturing. A varied role you will work with a diverse range of clients across multiple industry sectors including automotive, aerospace, rail, food & drink, electronics, defence, O&G and construction/civil engineering.
As an experienced development engineer you will engage with industrial clients on R&D projects, supporting them with the transfer of new technology and innovations into industry to deliver project requirements.
In addition as a senior member of the team you will mentor and support the development of research engineers, working with the manufacturing manager to plan available resources within the department.
You will also develop proposals for individual research and development projects to meet clients’ needs; taking account of technology readiness, time, quality and cost.
This exciting opportunity is suited to an experienced scientist or engineer with proven expertise within the design, development and reliability engineering of advanced electronics packages and modules as evidenced by commercialised processes, technical publications, patents and/or participation with professional associations. You will need to be able to work with a high level of autonomy to conduct complex projects/tasks. Preferably you will hold a relevant graduate or postgraduate qualification.
Further beneficial experience includes experience packaging a range of semiconductor materials including silicon, SOI, SiC and GaN for harsh environments/high temperature operation. As well as experience of high precision placement, bonding and connection for photonic or micromechanical devices.
To apply for this exciting position please send your CV to email@example.com or alternatively email for more information.